Points:3552
Size:295.78*322.25 MM
Number of components:254
2 sides reflow+DIP+press fit+Flip Chip
Minimum package:0402
Minimum pin spacing:0.5 MM
Points:3113
Size:282*322.25 MM
Number of components:172
Points:5631
Number of components:308
2 sides refolw+DIP+Flip Chip
Minimum package:0201
Points:1622
Size:160.13X121.11 MM
Number of components:164
2 sides reflow+DIP
Points:623
Size:334X97 MM
Number of components:70
Points:722
Size:380X400 MM
Number of components:132
Points:853
Size392*260.2 MM
Number of components:138
2 sides reflow+press fit
Points:223
Number of components:67
Points:440
Size:57.98*64.5 MM
Number of components:75
2 sides reflow
GPU:8
Form Factor:4U
CPU:4th/5th Intel Xeon Scalable
DlMM Slots:24 or 32
GPU:8 or 10
12 x NVMe SSD drives + 8 x SATA/SAS硬盘
PSU:Quad 2000W/2600W/3000W
GPU:2 or 4
Form Factor:2U
LAN Speed:10Gb/s
Ports: 2
CPU:4th Gen AMD EPYC 9004
DlMM Slots:12 or 24
PSU:Dual 900W/1500W/2000W/3000W
Form Factor:1U
10 x 2.5" SAS/SATA drives/SSDs
8 x 2.5" SAS/SATA drives/SSDs
Storage:M.2 & SD Card
Memory:16GB LPDDR5
Environment:-10~60C
Power:9~36Vdc
CONTACT
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